The Swiss manufacturer has doubled the beam height on the 1,800x3,200mm G3 L-3200 and 2,270x3,200mm G3 XL-3200 to 120mm, enabling them to cut substrates up to 110mm thick.

Zünd said that this would allow users to handle a wider range of substrates, including corrugated cardboard, solid cardboard, foam, sandwich material and corrugated plastic.

The previous maximum substrate thickness the G3 could accomodate was 50mm.

Oliver Zünd, chief executive of Zünd, said: "By enabling the G3 to handle thicker materials, converters can now cut a wider range of substrates, saving time and increasing efficiency, both critical factors in today's just-in-time packaging operations."

He added that the development was the result of customer feedback from existing G3 users.

"Feedback from our G3 installed base showed the requirement for an advanced version of this digital cutting system to manage a wider range of material," he said.

"We're confident that packaging printers investing in the re-engineered G3 cutter with 120mm beam height will improve their production performance and extend their business opportunities."