Equipment manufacturers
Gandy Digital launches ‘Softjet’ soft signage printer
Wide-format equipment manufacturer Gandy Digital has launched a new dye-sublimation printer, the Gandy Digital Softjet.
DS Smith in world first with Onset S40i corrugated printer
DS Smith has been revealed as the first packaging company worldwide to have installed Fujifilm's digital print system for corrugated board, comprising the Onset S40i, Uvijet OL inks and an automated...
Canon launches Digital Dimensions hub
Canon has launched a subscription-based online hub, Canon Digital Dimensions, with the aim of helping its customers to grow their businesses.
Roland DG launches Texart RT-640 dye-sublimation printer
Roland DG has launched the Texart RT-640, a 1.6m-wide dye-sublimation transfer printer available in dual CMYK or eight-colour configurations.
Kodak to offer NexPress upgrades as standard from 2015
Kodak has announced four enhancements to its NexPress range that will become standard on all presses from the beginning of next year.
Stephens & George prepares for arrival of second XL 106-8-P
Stephens & George (S&G) is gearing up for the arrival of its second Heidelberg Speedmaster XL 106-8-P, which will replace one of its existing 10-colour perfectors when it is installed in January 2015.
UPDATE: HP confirms plan to hive off Personal Systems and Printing businesses into new company
HP has confirmed that it plans to separate into two publicly traded companies by the end of the next financial year (fiscal 2015).
Color-Logic highlights VDP capability
Color-Logic has flagged up an apparently little-known feature of its metallic effects software: the ability to handle variable data.
Connect Packaging makes digital foray following sale to CBS
Connect Packaging has installed its first digital press as part of a £750,000 investment backed by its new parent CBS Packaging, which acquired the Essex-based converter in December 2013.
Zünd launches re-engineered G3 cutter
Zünd has re-engineered its G3 digital flatbed cutter, doubling the beam height on certain models to enable them to handle thicker substrates.